All-silicon optical contactless testing of integrated circuits
نویسندگان
چکیده
A novel approach for replacing mechanical probes used for wafer level testing with an optical contactless method for the application and extraction of test vectors from advanced silicon integrated circuits (ICs) is described. Experimental results demonstrate its feasibility, using a novel silicon light-emitting diode (LED) and silicon light sensors fabricated on the IC. The proposed method uses visible light and device structures that are completely compatible with standard silicon IC processing. The optical test-head is inexpensive, fabricated with standard microscope optics, and allows the simultaneous use of mechanical probes for power and other signals.
منابع مشابه
Optical Contactless Testing
2 0740-7475/06/$20.00 © 2006 IEEE Copublished by the IEEE CS and the IEEE CASS IEEE Design & Test of Computers WITH DECREASING FEATURE SIZE and increasing chip densities, the classical mechanical probe approach for internal fault detection and functional testing faces increasing challenges. Mechanical probes have limitations because of their relatively large size and inherent parasitic effects....
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